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Package Assembly

Analysis and Design

Equipment Manufacturer

EMS & Box Assembly

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Pacific Gate Technologies

Manufacturer's Representative
 

Enabling Solutions, Inc. provides customers with "Best in Class," one-stop solutions for all System-in-Package and high-speed Signal Integrity design-related problems.

We are a Silicon Valley-based engineering company focused on:

  • System-in-Package - schematic to prototype
  • Signal integrity solutions
  • Package and interconnect electrical characterization and simulation
  • BGA substrate design and layout

SIGNAL INTEGRITY

We provide signal integrity services for optimization of chip pad layout, package layout, and board routability. Our SI services include:

  • Power Integrity Analysis 
  • Signal Integrity Analysis
  • Package Parasitic Characterization
THERMAL ANALYSIS

Our thermal analysis services include:

  • Detailed (CFD) thermal analysis of packaging architectures
    • BGA, FPBGA, QFP, QFN, etc.
     
  • Compare and contrast various thermal solutions
      
  • Specification of heat sink solutions based on system application
     
  • Analysis Capabilities
    • Chip level (based on chip power map)
    • Package level (package design)
    • Board level (component layout)
    • System level (system design)

SYSTEM-in-PACKAGE

Enabling Solutions, Inc. has been providing layout design and electrical enhancement services for RF SiP and memory-based SiP to Silicon Valley startups as well as some of the largest IDM companies for over 6 years. Our engineers have years of experience in RF analysis and layout optimization. The majority of our designs are in high volume production with our customers.

  • Quick-turn Proto: From schematic to actual parts in ~30 days
     
  • Optimize for size, performance, and cost
     
  • Highly experienced in:
     
    • Wi-Fi SiPs
       
      • Bluetooth
         
      • 802.11a/b/g
         
      • For mobile and embedded applications
         
    • Stacked memory SiPs
       
      • For memory cards
         
 
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